Skip to main content
Latest News:

Qucell Selects Radisys for 5G Small Cells

Radisys Connect RAN Software Selected by Celona for Integration within its Critically Acclaimed 5G LAN Solution

Radisys Launches 5G IoT Software Suite

Radisys Introduces Engage Digital Platform for Service Providers to Monetize 4G, 5G and Fixed Network Investments in New Ways

Qualcomm and Reliance Jio Align Efforts on 5G

COM E for A&D

It was a great day yesterday for the COM E team here at Radisys, with the announcement of the CEQM67HD. It’s the first ruggedized COM Express module with quad-core Intel® Core™ i7 processing and a -40 C to +85 C temperature range to hit the market, and we’re very excited about the benefits it provides to our A&D partners.

Optimizing the performance of A&D systems today can only be accomplished by putting more processing power into compact, mobile and rugged form factors that can withstand extreme environmental conditions. The new Radisys CEQM67HD combines quad-core i7 processing with the small, 95mm x 125mm COM Express form factor over the -40 C to +85 C temperature range, addressing the performance, size and ruggedness that modern A&D applications need.

What’s more, we also provide the confidence associated with an extended product lifetime and future upgradability backed by full life-cycle support.

Want to hear first-hand from one of our customers why the CEQM67HD is beneficial for A&D deployments? Click here to read the news release that includes a comment from Synexxus.